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Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.

Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.

Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box. 

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  1. Products 142 items
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49-72 of 142 Items

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  1. ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer
    ATC3750-6C NVIDIA Jetson AGX Orin Edge AI Computer

    NVIDIA Jetson AGX Orin Solution Performance Edge AI Computing for Rail

    Key Features:

    • Built-in NVIDIA Jetson AGX Orin SOM, up to 200/275 TOPS (INT8) performance
    • Designed with rugged, compact and the hybrid thermal solutions
    • 6-port GbE PoE+ (x-coded) for IP CAM/LiDAR sensors, optional 1-port 10GbE (x-coded)
    • HEVC/H.265 hardware DECODE@ 6 x 4K30 performance
    • Wide range operating temperature of -30°C~70°C
    • Ultra-speed PCIe 4.0 x4 NVMe SSD for data integrity
    • Expansible for GNSS, LTE/5G NR & Wi-Fi 5/6
    • 24V DC-IN for rail, ignition control & OCP/OVP
    • NEXCOM Acceleration Linux (NAL) integrated w/ JetPack 5.1.1
    • Military standard of MIL-STD-810H for anti-vibration/shock
    • CE/FCC, UKCA, EN50155 (EN55011, EN50121-3-2, EN61373, OT4) Certified
  2. VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5GCIoT/7GCIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x 2.5GbE + 1 x GbE, 1 x USB 2.0,
    3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  3. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  4. VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5HCIoT/7HCIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU, 4 x PoE + 1 x GbE, 1 x USB 2.0, 3 x USB 3.2, 2 x RS232/422/485, 1 x 2.5”SSD, 1 x mSATA, 9~36VDC/IGN

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0 & 2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  5. VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer
    VTC7260-5HBIoT/7HBIoT Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU 9~36V DC-IN with ignition control

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~65°C (15W TDP)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  6. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  7. ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen
    ICO520 DIN-Rail Fanless Embedded Computer with 12th Gen

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  8. VTC7260-xC4 Fanless AI-Aided Vehicle Computer
    VTC7260-xC4 Fanless AI-Aided Vehicle Computer

    Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

    Key Features:

    • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
    • Compact, rugged and fanless design
    • Rich I/Os, 4 x PoE+, GbE, 4 x USB 3.2/2.0&2 x RS232/422/485
    • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
    • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
    • Triple display, VGA, HDMI and DP for multi video-out
    • 9~36V DC-IN with ignition control & OCP/OVP
    • Wide range operating temperature of -30°C~60°C (15W TDP&PoE)
    • Military standard of anti-vibration/shock for OHV applications
    • CE/FCC, UKCA, Emark Certified
  9. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  10. eBOX671B Fanless Embedded System with 13th/12th Gen
    eBOX671B Fanless Embedded System with 13th/12th Gen

    eBOX671B Fanless Embedded System 13th/12th Gen Intel® Core™ 2.5GbE M.2 Key M&E&B USB3.2

    Key Features:

    • 13th/12th Gen Intel Core i9/i7/i5/i3 and Celeron
    • processors with Intel R680E chipset (Alder Lake S)
    • Dual DDR5 SO-DIMM for up to 64GB of memory
    • 4 LAN with optional PoE supported
    • Dual 2.5" SATA HDD drive bays with RAID 0 & 1
    • Supports MXM 3.1 Type A, up to 5 display outputs
    • -40 °C to +65 °C wide operating temperatures
    • Wide range power input from 9 to 36 VDC
    • Flexible I/O window supported via mPCIe modules
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