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  1. Neu-X303mini Edge Computing System 12th Gen CPU
    Neu-X303mini Edge Computing System 12th Gen CPU

    12th Gen. Core CPU, 4 x 4K@60Hz display output, DP, HDMI 2.1, 2 x USB 3.2 Type-C, Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection

    Key Features:

    • 12th Generation Intel Core (Alder Lake - PS) processor SoC
    • Four 4K@60Hz display output, DP, HDMI 2.1 and 2 x USB 3.2 Type-C
    • Dual 2.5G LAN ports, 4 x USB 3.2 and 2 x USB 3.2 Type-C ports for easy connection
    • Onboard M.2 2280 Key M with PCIe signal for storage modules
    • Onboard M.2 2230 Key E for optional Wi-Fi modules
    • Compact design (L: 183mm, W: 137.9mm, H: 47.9mm)
    • 12V DC in
  2. EMS-TGL Fanless Rugged Embedded System 11th Gen
    EMS-TGL Fanless Rugged Embedded System 11th Gen

    11th Gen. Core i7/i5/i3 BGA Processor, Rich I/O, support 5G module, fanless operation temperature -40°C ~ 70°C

    Key Features:

    • On board 11th Gen. Intel Core i7/i5/i3 BGA Processor
    • 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
    • Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
    • Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G BaseTx GbE
    • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
    • CE, FCC Class B, IP50
    • Wide range DC power input from +9~32V
    • Support HW TPM 2.0
    • Support vPro
  3. ICO520 Fanless Embedded System 12th Gen i7/i5/i3
    ICO520 Fanless Embedded System 12th Gen i7/i5/i3

    Axiomtek ICO520 DIN-Rail Fanless Embedded-System 12th-Gen Intel®-Core™ 4x2.5GbE, 4xIsolated-COM, Isolated DIO (8-in/8-out)

    Key Features:

    • High performance with fanless and DIN-rail design
    • 12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Alder Lake-P)
    • 4 isolated COM, isolated DIO (8-in/8-out), 4 2.5 GbE LAN
    • Wide operating temperature range from -40°C to +70°C
    • 9 to 36 VDC, typical 12-24V power input with OVP, UVP, OCP, RPP
    • Supports TPM 2.0
    • Supports cold boot at -40°C
  4. ACS10-TGU 11th Gen Intel Fanless Compact System
    ACS10-TGU 11th Gen Intel Fanless Compact System

    Compact and easy to set up, highly expandable I/O interfaces and flexible storage design, and supports high-resolution graphics

    Key Features:

    • 11th Gen Intel Core i5/i3 Tiger Lake-UP3 Processor
    • Intel Iris Xe/ UHD Graphics Engine
    • 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
    • 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
    • 2-COM Port (RS-232/422/485 & RS-232)
    • 2-Audio Jack (Line-Out & Mic-In)
    • 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
    • 2-Expansion Slot (M.2 Key-E, Key-B)
    • 6-USB Port (3-USB 3.2 & 3-USB 2.0)
    • CE, FCC Class A, UKCA
  5. UST500-517-FL Fanless Embedded System 7th/6th Gen
    UST500-517-FL Fanless Embedded System 7th/6th Gen

    Fanless Embedded System with 7th/6th Gen Intel Core, Pentium and Celeron Processor

    Key Features:

    • CE, FCC, E-Mark, EN 50155 and EN 45545-2 certified
    • LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 65W) with Intel® Q170 (Kaby Lake/Skylake)
    • Fanless and Wide operating temperatures from -40°C to +70°C
    • Flexible LAN selection, up to 16 RJ-45 GbE PoE LAN ports
    • 24 VDC power input
    • Intelligent solution of vehicle power management (ACC ignition)
    • Convenient and Accessible Storage, two/four 2.5” SATA drive, 1 mSATA
  6. eBOX630A Fanless Embedded System with 11th Gen Core
    eBOX630A Fanless Embedded System with 11th Gen Core

    Fanless Embedded System with 11th Gen Intel Core i7/i5/i3 or Celeron Processor, 2 HDMI, 1 DisplayPort, 3 LANs, 6 USB, 4 COM, and 9 to 48 VDC

    Key Features:

    • 11th gen Intel Core i7/i5/i3 or Celeron Quad-core ULT processor (Tiger Lake UP3)
    • Dual-channel DDR4-3200 SO-DIMM for up to 64GB of memory
    • Supports 3x 2.5 GbE, 6 USB, 4 COM
    • -40°C to +60°C wide operating temperatures
    • 9 to 48 VDC wide range DC power input
    • Supports triple displays with 2 HDMI, and 1 DisplayPort++
    • Intel Iris Xe integrated graphics (i7 & i5 SKUs)
    • Trusted platform module (TPM 2.0 onboard)
  7. eBOX710A Fanless Embedded System 11th/10th Gen
    eBOX710A Fanless Embedded System 11th/10th Gen

    Fanless Embedded System with LGA1200 Socket 11th/10th Gen Intel Core i9/i7/i5/i3 or Celeron Processor, Intel H420E, HDMI, DisplayPort, 6 USB, 4 LAN, PCIe x4 slot, and 9 to 48 VDC

    Key Features:

    • 10th/11th gen Intel Core i9/i7/i5/i3 or Celeron processor up to 65W
    • 4 GbE LAN and 4 COM ports
    • Dual 2.5" SATA HDD drive bays
    • 2 HDMI and 1 DisplayPort with dual view supported
    • -40 °C to +70 °C wide operating temperatures
    • Wide range power input from 9 to 48 VDC
    • 1 PCIe x4 slot for I/O card
    • Flexible I/O window slot for mPCIe modules
  8. NDiS-B338 Fanless Embedded PC Celeron J6412
    NDiS-B338 Fanless Embedded PC Celeron J6412

    Slim/fanless player with extended temperature durability, HDMI display, USB 3.0 ports, and a RS232/RS422/RS485 interface

    Key Features:

    • Intel Celeron J6412 processor
    • Support 3 x HDMI 2.0 output
    • Support 12V~24V DC input
    • Compact and slim design (H: 38.8mm)
    • 2 x DDR4 up to 32G
    • 1 x M.2 2280 Key M for optional storage device
    • 1 x M.2 3042/3052 Key B for optional LTE or 5G modules
    • 1 x mini-PCIe for optional Wi-Fi and LTE
    • Fanless design
  9. NISE-70 Celeron/Core Fanless System
    NISE-70 Celeron/Core Fanless System

    Intel Celeron 6305E Processor Dual Core Fanless System

    Key Features:

    • Onboard Intel Celeron 6305E Processor
    • 4 x HDMI
    • 3 x USB 3.0, 1 x USB 2.0
    • 1 x RS232/422/485, 1 x RS232
    • 3 x GbE LAN ports; support WoL, teaming and PXE
    • Onboard TPM 2.0 chip
    • 1 x M.2 socket for storage/4G LTE/5G modules
    • 1 x mini-PCIe socket support optional mSATA/Wi-Fi/BT/4G LTE module
    • Support operating temperature from-5 to 55 Celsius degree
    • Support+12V to 24VDC input; support ATX power mode
  10. AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin
    AIE900A-AO Fanless Edge AI System w/ NVIDIA Jetson AGX Orin

    Fanless Edge AI System with NVIDIA Jetson AGX Orin, 2 2.5GbE, 8 PoE, and 2 COM/CAN for 5G and Robotics Applications

    Key Features:

    • NVIDIA Jetson AGX Orin with 1792-core NVIDIA Ampere GPU
    • 1 M.2 Key B slot for 5G/LTE, 1 M.2 Key E slot for Wi-Fi 6(E)
    • 24 VDC with ignition power control
    • Supports eight PoE for IP cameras and LiDAR connectivity
    • -30°C to +50°C operating temperature range
    • Supports device management and optional OTA deployment powered by Allxon
  11. NDiS-B561 12th Gen Fanless Edge PC PoE Option
    NDiS-B561 12th Gen Fanless Edge PC PoE Option

    Visual Edge PC 12th Gen Core Processor -20~60°C 1 x HDMI 2.1 2 x HDMI 2.0 8 x USB 3.2 4 x COM

    Key Features:

    • Support 12th Gen Intel Core i9/i7/i5/i3 LGA socket type embedded processor, up to 35W
    • Intel Q670E
    • Intel integrated UHD graphic engine driven by Xe architecture
    • Support 3 independent 4K2K@60Hz display outputs. HDMI 2.1 resolution can be up to 8K@60Hz
    • 1 x HDMI 2.1, 2 x HDMI 2.0
    • 8 x USB 3.2, 4 x COM,
    • 1 x GbE LAN, 2 x 2.5G GbE LAN (PoE for B561-PoE)
    • Support M.2 Key B/E/M
    • Support extended temperature -20~60°C (B561 only)
    • Fanless design
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