Find your technical solution below
Tekdis products are categorised into the groups below. Once you select the correct category use the filters to locate the best product for your application.
Depending on the category there are numerous filters to help you identify the ideal solution. If you have other questions or requests we are always available via phone or email and will aim to respond within the hour.
Tekdis can "build to order" a complete solution including Operating System and SSD imaging so systems will be preconfigured out of the box.
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AV600X-CH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 9th Gen. Coffee Lake (H) Xeon® E-2276ML processor
- Up to 128GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- NVMe 3.0 512GB.(MB/sec, Max.) 3,400/3,200 MB
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 55°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 313.5 (W) x 100 (H) mm
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AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
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AV600TH Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MLE Processors, up to 8 cores
- 64GB DDR4 SO-DIMM ECC or non ECC support
- NVIDIA RTX™ A2000 MXM 8GB GDDR6 2560 CUDA cores
- 2.5” SATA SSD
- 1x 3G-SDI Capture Card (Options)
- MIL-STD-461 18V~36V DC-Input
- Extreme Temperature: -20 to 55°C degrees
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PPC2-CW133-EHL 13.3” Fanless Panel PC with Celeron J6412
13.3” Fanless Panel PC with Intel Celeron Processor J6412
Key Features:
- Intel Elkhart Lake Platform
- Dual M.2 (M.2 B Key & M.2 M Key) support
- Anti-glare and Anti-UV PCAP
- Support Gloved and Wet Hand Operation
- Newly Designed Panel Mount Kit
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PCIE-Q470 Full-size PICMG 1.3 10th/11th Gen CPU
Full-size PICMG 1.3 CPU Card i9/i7/i5/i3Pent/Celeron, DDR4, HDMI, Dual 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, IAUDIO and RoHS
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AV600-RH Military IP66 AI Edge GPU Computer
Military IP66 with D38999 connectors VIDIA RTX A1000/A2000, 2048/2560 CUDA
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel 13th Gen. Raptor Lake (H) i7-13800HE/HRE, 14C , 2.5/5.0 GHz Processor
- Up to 64GB DDR5 SO-DIMM, non-ECC and ECC
- NVIDIA RTX A1000/A2000, 2048/2560 CUDA,4GB/8GB GDDR6 RAM
- MIL-STD-461 EMI Filter18V~36V DC-Input
- Extreme Temperature : -40°C to 60°C
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
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HPCIE-Q470 Half-size PICMG 10th/11th Gen CPU
Half-size PICMG 1.3 CPU Card LGA1200 10th/11th Gen Intel Core i9/i7/i5/i3/Pentium/Celeron with Intel Q470/Q470E, DDR4 SO-DIMM, HDMI, Dual Intel 2.5GbE, USB 3.2 Gen 2, SATA 6Gb/s, M.2, IAUDIO, and RoHS
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KINO-DH420 Mini-ITX SBC 10th Gen CPU
Mini-ITX SBC LGA1200 Intel 10th Generation Core i9/i7/i5/i3/Pentium/Celeron, DDR4, dual displays, 3x2.5 GbE LAN, M.2, SATA 6Gb/s, HD Audio and RoHS
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IMBA-Q471 ATX Motherboard LGA1200 Intel 10th Gen Core/Cele/Pent
ATX industrial motherboard supporting 10th/11th Intel Core i9/i7/i5/i3, Celeron, Pentium processors
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WAFER-ULT3 3.5” SBC 6th Gen i7/i5/i3/Celeron
3.5” SBC supports Intel® 6th Generation ULT Processor with DDR4 SO-DIMM/On-board Memory Support
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WAFER-LX-800 3.5” SBC with on-board AMD Geode LX 800 ProcessorEnd of Life
3.5” SBC with on-board AMD Geode™ LX 800 Processor
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DRPC-230-ULT5 Fanless DIN-Rail Embedded System
Fanless embedded system, Intel Whiskey Lake i5-8365UE 1.6GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP, 3 PCIe GbE, 6 COM, 12~24V DC, PCIex4 extension layer and RoHS
Key Features:
- Whiskey Lake Core i5-8365UE
- Triple GbE LAN Ports
- Multiple USB 3.2 Gen 2 (10Gb/s)
- Multiple COM Ports
- Modulized Flexible Expansion
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WAFER-KBN-i1 3.5” SBC supports AMD Embedded G-Series SoCEnd of Life
3.5” SBC supports AMD® Embedded G-Series SoC
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WAFER-BT-i1 3.5” SBC Atom/Celeron on-board SoCEnd of Life
3.5” SBC with Intel® 22nm Atom™/Celeron® on-board SoC, VGA/LVDS/iDP, Dual PCIe GbE, USB 3.0, PCIe Mini, SATA 3Gb/s, WAFER-BT-i1 mSATA, COM, Audio and RoHS
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uIBX-250-BW Ultra Compact Size PC
Std build - Fanless Celeron® N3160, 4GB RAM, 128GB Wide Temp SSD, Win 10 IOT pre-loaded
Contact for other builds/configs. -
PCISA-BT Half-size PCISA Atom
Half-size PCISA CPU Card supports Intel® 22nm Atom™ On-board SoC with VGA
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PCIE-Q870-i2 Full-size PICMG i7/i5/i3/Pentium/Celeron
Full-size PICMG 1.3 CPU card supports LGA 1150 Intel® Core™ i7/i5/i3, Pentium® and Celeron® CPU per Intel® Q87
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PCIE-H810 Full-size PICMG i7/i5/i3/Pentium/Celeron
Full-size PICMG 1.3 CPU card supports LGA 1150 Intel® Core™ i7/i5/i3, Pentium® and Celeron® with Intel® H81
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NANO-ULT3 EPIC SBC 6th Gen i7/i5/i3/Celeron
EPIC SBC supports Intel® 14nm 6th Generation Mobile Core™ i7/i5/i3 and Celeron® on-board Processor (ULT)
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KINO-KBN-i2 Mini-ITX SBC with AMD Embedded G-Series SoCEnd of Life
Mini-ITX SBC with AMD® Embedded G-Series SoC